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AMD and Supermicro Work Together to Produce the Latest High-Performance Computers

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AMD and Supermicro Work Together to Produce the Latest High-Performance Computers

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Solving some of business’ bigger computing challenges requires a solid partnership between CPU vendor, system builders and channel partners. That is what AMD and Supermicro have brought to the market with the third generation of AMD's EPYC™ processors with AMD 3D V-Cache™ and AMD Instinct™ MI200 series GPU accelerators wrapped up in SuperBlade servers built by Supermicro.

 

“This has immediate benefits for particular fields such as crash and digital circuit simulations and electronic design automation,” said David Weber, Senior Manager for AMD. “It means we can create virtual chips and track workflows and performance before we design and build the silicon." The same situation holds for computational fluid dynamics, he added, "in which we can determine the virtual air and water flows across wings and through water pumps and save a lot of time and money, and the AMD 3D V-Cache™ makes this process a lot faster.” Without any software coding changes, these applications are seeing 50% to 80% performance improvement, Weber said.

 

The chips are not just fast, they come with several built-in security features, including support for Zen 3 and Shadow Stack. Zen 3 is the overall name for a series of improvements to the AMD higher-end CPU line that have shown a 19% improvement in instructions per clock, lower latency for doubled cache delivery when compared to the earlier Zen 2 architecture chips.

 

These processors also support Microsoft’s Hardware-enforced Stack Protection to help detect and thwart control-flow attacks by checking the normal program stack against a secured hardware-stored copy. This helps to boot securely, protect the computer from firmware vulnerabilities, shield the operating system from attacks, and prevent unauthorized access to devices and data with advanced access controls and authentication systems.

 

Supermicro offers its SuperBlade servers that take advantage of all these performance and security improvements. For more information, see this webcast.

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Supporting Complex Computational Needs with Turnkey Computer Clusters

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Supporting Complex Computational Needs with Turnkey Computer Clusters

Building the next generation of technical computing equipment has become easier, thanks to the combination of International Computer Concepts’ (ICC) hardware and Define Tech Ltd.’s software and firmware. The result marks a new direction for this market segment, offering a more flexible and useful approach, because it comes with software and applications for running complex engineering simulations.

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  • International Computer Concepts (ICC), Define Tech Ltd.

Building the next generation of technical computing equipment has become easier, thanks to the combination of hardware from International Computer Concepts (ICC) and software and firmware from Define Tech Ltd. You'll find the combined technology delivering solutions like computer-aided engineering, finite element analysis, computational fluid dynamics and geologic data analysis.

 

Such applications depend on huge datasets and complex computational requirements. They typically rely on clusters of multi-core computers, distributed storage and high-speed networking components.

 

The combination is called a turnkey cluster, and it is a good description because it marks a new direction for this market segment. In the past, clustered computers required a great deal of custom assembly, matching the components for throughput and performance, plus developing special firmware and software to take advantage of these benefits. This solution from ICC and Define Tech offers a more flexible and useful approach, because it comes with software and specialized applications that are optimized for running complex engineering simulations, such as Ansys and OpenFOAM.

 

The applications run across a collection of CPU chipsets from AMD, including the latest version of AMD’s EPYC 7003 series of processors that feature high processor core counts, high memory bandwidth and support for high-speed input/output channels in a single chip. These processors feature AMD 3D V-Cache technology and leverage true 3D die stacking for higher L3 cache delivery, which is helpful in these circumstances.

 

“With this latest addition to our HPC cluster suite, we aim to provide our customers an easy-to-use, cost-effective, AI-optimized solution made specifically for simulation-driven engineering workloads,” said ICC’s Director of Development, Alexey Stolyar.

 

For more on this, see ICC's project document as well as Define Tech’s explanatory page.

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